OCP ORv3-inspired liquid cooled systems able to cool up to 100kw per rack.
AMAX IntelliRack POD
AMAX IntelliRack POD Solutions feature advanced liquid cooling for GPU clusters, supporting up to 100kW per rack. These systems reduce power consumption, enhance performance reliability, and offer easy maintenance with front-side connections. They are designed for various computing environments and support high-performance models like NVIDIA H100, H200, and GH200.
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Key Features
Reduced Power Usage
Maximizes energy efficiency by outperforming air-cooling methods, significantly reducing power consumption.
Enhanced Cooling Capacity
Advanced liquid cooling technology expands the range of applications and enhances performance reliability.
Streamlined Servicing
Designed for hassle-free maintenance with no facility modifications required and easy front-side, blind mate connections.
Management Control System
Enables detailed monitoring and control of flow rates, temperatures, and speeds, ensuring precise system management.
Advanced Liquid Cooling
Why Use Advanced Liquid Cooling?
Traditional air cooling typically only supports up to 450W. Beyond that, there's a high risk of overheating and potential hardware damage with improper cooling.As processors advance to 500W+ TDP, transitioning to liquid cooling becomes crucial for efficient thermal management.Choosing liquid cooling is a proactive step to ensure your data center is ready for tomorrow's demands and the future of AI.
IntelliRack Series
Liquid Cooling for Every Environment
The IntelliRack series features a flexible portfolio of liquid-cooled rack solutions designed for a range of computing environments.
IntelliRack AL100
Hybrid cooling technology with rear door heat exchanger, exhausts all heat to facility water, delivering 100kW capacity
IntelliRack A45 & Sidecar
A closed loop liquid-to-air cooling solution equipped with either a RDHx or Sidecar attachment for up to 76kw Cooling.
IntelliRack L100
Advanced liquid-to-liquid and air-to-air cooling, efficiently handling 100kW without a rear door heat exchanger
Intel® Xeon® 6 Processor
AMAX Solutions with Intel® Xeon® 6 Processor
AMAX leverages Intel® Xeon® 6 Processors, optimizing performance for AI workloads. This technology enhances our ability to manage demanding data workloads for large scale HPC deployments, providing powerful and energy-efficient solutions for data centers.
IntelliRack + Sidecar
AVAILABLE NOW
IntelliRack A45 + Sidecar
The Sidecar attachment enables businesses and data centers to implement fully liquid-cooled servers without existing liquid cooling infrastructure, making it easy to deploy in any computing environment.
- No Facility Water Needed
- 76 kW Cooling w/ Sidecar or 45kW Cooling w/ RDHx
- 220 VAC Power w/ Sidecar or 48 VDC w/ RDHx
- Hot Swappable Redundant Fan/Pump/PSUs
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Specifications
IntelliRack Series Comparison
| Feature | IntelliRack A45 + Sidecar | IntelliRack AL100 | IntelliRack L100 |
|---|---|---|---|
| Cooling Mechanism | Air-Assisted Liquid Cooling | Liquid-to-Liquid and Air-to-Liquid | Liquid-to-Liquid and Air-to-Air |
| Rack Size | 600mm x 1068mm x 2295mm | 600mm x 1287mm x 2295mm | 600mm x 1068mm x 2295mm |
| Cooling Capability | 76kW | 100kW (100% w/ RDHx; 80% w/o RDHx) | 100kW (80% heat dissipated through liquid) |
| Computing Node Compatibility | RU/OU 21" server compatible | RU/OU 21" server compatible | RU/OU 21" server compatible |
| Redundancy | 15+1 Fans, 2+1 Pumps, 3+3 PSUs | 1+1 Pumps, 2+1 PSUs | 1+1 Pumps, 2+1 PSUs |
| Serviceability | Front-Access, Hot swappable: Fans, Pumps, PSUs, Control Board | Blind-mate mechanism, Front Access IT equipment, Slide-rails compatible, Hot swappable: Pumps, PSUs, Control Board | Blind-mate mechanism, Front Access IT equipment, Slide-rails compatible, Hot swappable: Pumps, PSUs, Control Board |
OCP ORv3
Open Rack Architecture
- 21-Inch Open Rack V3: 29% additional front surface area, optimizing server component airflow.
- High Voltage DC Busbar: Removes the need for rack PDUs, outlets, and power cords at the rear of the rack.
- Liquid Cooling Solutions: Enhances efficiency, density, and sustainability through direct-to-chip cooling methods.
- High Density Power Shelf: 48V DC power directly to the busbar, eliminating traditional power supplies.
- Rear-Mounted Liquid Manifold: Facilitates blind-mate connection for easy installation and maintenance.
- Open Rack V3 High Density System: Improves power savings and operational efficiency.
Why AMAX
Engineering Expertise
Our team of thermal, electrical, mechanical, and networking engineers are skilled in designing solutions designed to your specific requirements.
Solution Architects
AMAX's solution architects optimize IT configurations for performance, scalability, and industry-specific reliability.
Networking
AMAX designs custom networking topologies to enhance connectivity and performance in AI and HPC environments.
Thermal Management
AMAX implements innovative cooling technologies that boost performance and efficiency in dense computing setups.
Compute Optimization
AMAX ensures maximum performance through benchmarking and testing, aligning hardware and software for AI workloads.
AI Architects
From Design to Deployment
AMAX's approach to AI solutions begins with intelligent design, emphasizing the creation of high-performance computing and network infrastructures tailored to AI applications. We guide each project from concept to deployment, ensuring systems are optimized for both efficiency and future scalability.
Contact our team today to discuss your next project.
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